402 A Slit Laminar MCP Using Polyimide Substrates Economical Micro-Channel Plate Construction Using Kapton Tape and Advanced Additive Processes
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Description: Contents 1 Introduction 4 2 Material Properties, Gamma Absorption Cross-sections, and Electron Ranges 5 2.1 Materials and Material Properties . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Gamma Absorption Cross-sections and Absorption Lengths . . . . . . . . . . . 6 2.3 Electron Range Plots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 Substrate Thicknesses for 90%Electron Range at Normal Incidence . . . . . . . 9 2.5 Efficiency Plots for the Primary Electron To Cross a Channel Wall Versus Lamina Thickness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3 The Simple Slit MCP 12 3.1 Proposed Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.2 A HighRes Gamma Multiplier Tube (HGMT) Comprising a Single Layer of CLMP and ALMCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.3 The Slit Converter LMCP (CLMCP) . . . . . . . . . . . . . . . . . . . . . . . 14 3.4 The Slit Amplifier LMCP (ALMCP) . . . . . . . . . . . . . . . . . . . . . . . 15 4 Integrated-Anodes and Stacked Multiple MCPs 16 5 Lamina Construction 17 5.1 Treatment of the ‘Front’ and ‘Back’ Sides of the Lamina . . . . . . . . . . . . 18 5.2 Spacers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.3 HV Distribution System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.4 Resistive Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.5 Emissive Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.6 Anode Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6 Concerns 19 7 Summary 19 8 Appendix A: Electrostatic Channels 19 8.1 Channel/Wall Field Shaping By Metal Equipotentials . . . . . . . . . . . . . . 20
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